FPGA的热管理.pdf

Thermal Management for FPGAs February 2007, v1.1 Application Note 358 Introduction As IC process geometries shrink and FPGA densities increase, managing power becomes increasingly difficult. The dilemma for design groups is how to fit in all the functions the market demands without exceeding power budgets. Although power has been a third- or fourth-order concern for most FPGA designs, it is now an important concern for designs at 90 nm and below. The more power a device consumes, the more heat it generates. This heat must be dissipated to maintain an optimal operating temperature. The design of Altera® device packages minimizes thermal resistance and maximizes power dissipation. However, some applications dissipate more power and require external thermal solutions, including heat sinks. This application note provides guidance on managing thermal performance. Heat Dissipation Radiation, conduction, and convection are three ways to dissipate heat from a device. PCB designs use heat sinks to improve heat dissipation. The thermal energy transfer efficiency of heat sinks is due to the small thermal resistance between the heat sink and the air. Thermal resistance is the measure of a substance’s ability to dissipa