Sample Project1_工作计划_计划解决方案_实用文档.ppt

Analyze - Summary Problem Validated Causes White residue Temperature profile Solder paste Contamination Solder paste Temperature profile (Oven) Fixture fixing Splash Solder paste Fixture fixing Tombstone/IC bridge Temperature profile Solder paste Fixture fixing Connector solder bridge Stencil Connector solder missing Paste missing after connector installation Stencil Improve – Solution White residue/Contamination/Splash Solution: - Apply new type solder paste The result is proven in analysis phase Has little impact on process and improvement on sigma level Price of new paste is lower Need customer approval, may take long time Adjust temperature profile Can use DOE to find out the best setting May cause some defective products in production during DOE Improve – Solution Tombstone/IC bridge Solution: Apply new type solder paste Can be merged in solution for white residue/contamination Fine tune temperature profile (DOE) Can be merged in solution for white residue/contamination Amend fixture to improve fixing Need change all fixture in use, can be merged in the fixture replacement Also good for fixing in washing Improve – Solution Connector Solder Bridge Solution: Change stencil aperture design Order a new stencil and cost is RMB2500 Same design is proven applicable at other company Adjust the base plate to make printing carrier flat The adjustment depends on experience of operator/engineer Can be monitored by thickness measurement No cost issue Improve – Solution Connector Solder Missing Solution: Adjust after connector installation Need not change process setting Add an operation and improve HPU The operator may ignore it if in mass production Improve paste thickness Order a new stencil and cost is RMB2500. Romulus and Neptune will be EOL, can start from new programs Same design is proven applicable in other company Control – Determine Implementation New Solder Paste - Pilot run and approval Control lot for MSL analysis and Assy1 p