pcb印制电路板以及hdi生产流程详细介绍英文版.ppt

* Equipment Photo * Equipment Photo * Equipment Photo * Equipment Photo BACK HDI Products BACK * LASER BLIND BURIED VIA LAY-UP A = THROUGH Via Hole (導通孔) B = BURIED Via Hole (埋孔) C = STAGGER Blind Via (雷射盲孔 ) D C C D = TWO LEVEL Laser Via (雷射盲孔 ) C D C Prepreg FR-4 Core RCC FR-4 Core Prepreg RCC A B B A Buried Via and Laser Blind Via * 4Ls MLB with Blind Via Process BV LAYER 1 B-STAGE PTH LAYER 2 LAYER 3 LAYER 4 SHEARING D/F PHOTO IMAGE ( L2 , L3) LAMINATION CNC DRILL PANEL PLATING D/F PHOTO IMAGE (OUTER LAYER) LIQUID SOLDER MASK HOT AIR LEVELING LASER DRILL * 8Ls MLB with Blind Via Process DRILLING LAMINATION PTH DRILLING INNER LAYER IMAGE PTH INNER LAYER IMAGE ( L2 ) INNER LAYER IMAGE ( L7 ) D/S PROCESS L1-L2 L3-L4 L7-L8 L5-L6 BV PTH LAYER 1 LAYER 2 LAYER 3 LAYER 4 LAYER 5 LAYER 6 LAYER 7 LAYER 8 * 6Ls MLB with Blind Buried Via Process INNER LAYER IMAGE ( L3,L4 ) D/S PROCESS L3-L4 LAMINATION DRILLING PTH INNER LAYER IMAGE ( L2,L5 ) LAMINATION LASER DRILLING (L1-L2,L5-L6) DRILLING (MECHANICAL) PTH OUTER LAYER IMAGE ( L1,L6 ) BV PTH L 1 L 2 L 3 L 4 L 5 L 6 * 6Ls MLB with Blind Buried Via Process INNER LAYER IMAGE ( L3,L4 ) D/S PROCESS L3-L4 LAMINATION DRILLING PTH INNER LAYER IMAGE ( L2,L5 ) LAMINATION LASER DRILLING (L1-L2,L5-L6) DRILLING (MECHANICAL) PTH BV PTH L 1 L 2 L 3 L 4 L 5 L 6 OUTER LAYER IMAGE ( L1,L6 ) PLUGGING PANEL PLATIING * 8Ls MLB with Laser Blind Via Process INNER LAYER IMAGE(L2-L7) AOI Inspection L4-L5 L6-L7 BV PTH L 1 L 2 L 3 L 4 L 5 L 6 L 7 L 8 L2-L3 LAMINATION (L1-l8) LASER DRILLING (L1-L2,L7-L8) DRILLING (L1-L8) (MECHANICAL DRILL) PTH OUTER LAYER IMAGE ( L1,L8 ) Double Side PROCESS * 8Ls MLB with Laser Blind Via Process BV LAYER 1 LAYER 2 LAYER 3 LAYER 4 LAYER 5 LAYER 6 LAYER 7 LAYER 8 PTH LASER ABLATION (L1-L2,L7-L8) INNER LAYER IMAGE ( L3 ) D/S PROCESS L3-L4 LAMINATION (L2-L4) DRILLING (L2-L4) INNER LAYER IMAGE ( L6 ) OUTER LAYER IMAGE ( L1,L8 ) L5-L6 LAMINATION (L5-L7) DRILLING (L5-L7) PTH PTH LAMINATION (L2-L7) I