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超大规模集成电路分析与设计 图文.doc

发布:2018-04-25约4.16万字共83页下载文档
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3?′ó1??£?ˉ3éμ??··???ó?éè??_í??? 3?′ó1??£?ˉ3éμ??··???ó?éè?? VLSI Analysis and Design ?÷?2£o ??è? Email£ozhangran2012@ ?ì2?£¨I£? êé??£o ?? 3?′ó1??£?ˉ3éμ??·éè??μ? 3?°?é?£o ???a′ó?§3?°?é? ×÷??£o 2ìü2′è£??ü?? ±à?? 2????ì2?£¨II£? ? ??CMOS3?′ó1??£?ˉ3éμ??·éè??£¨μú3°?£??· 3?°?é?£o?D1úμ?á|3?°?é? ×÷ ??£o ???1ì?£¨?à£?£?1tà??1£¨?à£? ? ??3?′ó1??£?ˉ3éμ??·ó??μí3μ????· 3?°?é?£oμ?×ó1¤òμ3?°?é? ×÷ ??£o John P. Uyemura ??? Verilog HDLè???£¨μú3°?£? ?· 3?°?é?£o±±??o???o?ìì′ó?§3?°?é? ×÷ ??£o°í?1??£¨?à£? ? Modern VLSI Design: Systems on Chip£¨3rd Ed£? 3?°?é?£o ′??§3?°?é? ×÷ ??£o Wayne Wolf ISBN: 0-13-011076-0 ?ì?§ó???ê?°2?? ???3ìòa?ó £¨1£??????¢?á11?¢μ??·μ¥?a?¢?£Dí?¢2?êy?¢CAD 1y3ì £¨2£?êμ?ê·???μ?Díμ??·£??óé?éè???°?????±μ?àí ?a ??ì?§ê±??°2?? μú4-15?ü£????ü2????7-8?ú?¢?ü4é???3-4?ú ?3é?¨??o? ??ê?£¨70%£?+??ía×÷ò죨30%£? ??3ì?ééü£¨I£? ?VLSI ? ? system ì?μ? 1??£′ó£¨ê±Dò?¢?????′?ó£??¢êμì?D?£¨??ì?μ¥?aD?£??¢?ù?è?죨?μ?ê£??¢ 1|o?D? ??ê?·??§£o?ˉ3éμ??·?¢èè?§?¢?2μ??§?¢í????§?¢?μí3?????¢·???D?μ??·μè ? ? ?÷òa?à1???ê?£o?¢μ?×ó°?μ?ì??¢μ??·ó??μí3?¢?????úCAD MOS?á11?a?÷ì? ?VLSI·???oíéè??ó???????3ìμ???±e VLSI??3ìê?1è??é??ùóú?§íò???¢???§ì?1ü?á11×é???μ?μ??·??ê???3ì ? μ?×ó??ê??? PCBé?μ?μ??·??3ì ×ü??£?ê??a???£Dí?¢μ÷ê??¢·????¢×?o?μ???ê??êìa ? רòμó¢ó? ? Very-large-scale-integration (VLSI) is defined as a technology that allows the construction and interconnection of large numbers (millions) of transistors on a single integrated circuit. Integrated Circuit is a collection of one or more gates fabricated on a single silicon chip. Wafer is a thin slice of semiconductor material on which semiconductor devices are made.Also called a slice or substrate. Chip is a small piece of semiconductor material upon which miniaturized electronic circuits can be built. Die is an individual circuit or subsystem that is one of several identical chips that are produced after dicing up a wafer. ? ? ? ? 1.1 ?ˉ3éμ??·μ?·¢?1(1) ? Moore?ˉs Law £
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