高密度电子封装热管理中热电制冷技术的应用研究综述.doc

高密度电子封装热管理中热电制冷技术的应用研究综述 热电冷却电子封装热管理技术研究进展 王长宏，朱冬生，雷俊禧 （华南理工大学化学与化工学院，传热强化与过程节能教育部重点实验室，广东 广州 510640） 摘 要：随着芯片功率密度的迅速增大以及热点现象的存在，电子封装器件的散热问题一直是制约其发展的瓶颈，寻找新的散热方式来满足日益增长的散热需要已刻不容缓。研究在掌握电子封装热管理理论以及热电制冷原理的基础上，系统地总结了芯片的产热特征、散热需求与散热方式，对热电冷却技术在芯片散热系统上的应用进行了深入的理论分析，指出了其不足之处与特有的优势，对热电冷却技术在芯片热管理方面应用研究的进展与现状进行了总结评述。该研究工作为热电冷却技术在芯片热管理上的应用指明了发展方向。 关键词：电子封装；芯片热管理；热电制冷；散热 中图分类号：TB61+9.2 文献标示码：A 文章编号: Research Progress on Thermoelectric Cooling Applied in Electronics Packaging Thermal Management Wang Chang-hong, Zhu dong-sheng, Lei Jun-xi (Educational Ministry Key Laboratory of Enhanced Heat Transfer amp; Energy Conservation, school of chemistry and chemical engineering, South China University of Technology, Guangzhou 510640, China) Abstract: As the power density of electronic chip grows fast and the hot spot phenomenon appears in recent years, cooling or heat dissipation of high-heat-flux electronics packaging becomes the obstruction in the development of the electronic industry. So it is urgent to find a new method to meet the heat dissipation capacity of electronics packaging. The heat production characteristics, cooling requirement and heat dissipation mode of electronic chip were summarized systematically based on the theories of electronics packaging thermal management and thermoelectric refrigeration technology. The applications of thermoelectric cooling technology in electronic chip heat dissipation system, including disadvantages and advantages, were deeply analyzed and the in this paper. Furthermore, the research progress and present situation of thermoelectric cooling technology applied in electronics packaging thermal management were reviewed. The studies will pave a way to apply thermoelectric cooling technology in electronics packaging thermal management. Keywords: thermoelectric cooling; electronics packaging; chip thermal management; heat dissipation 21世纪，信息科学技术迅猛发展，而微电子技术作为信息技术的基础，它的发展将促进现代电子工业，特别是计算机、通讯和自动化技术的发展。根据摩尔定律及“超越摩尔”的概念，微电子技术一直在向更高性能、更