IC-芯片封装流程课件.pptx

IntroductionofICAssemblyProcess

IC封装工艺简介;FOL–BackGrinding背面減薄;FOL–WaferSaw晶圓切割;FOL–WaferSaw晶圓切割;FOL–2ndOpticalInspection二光檢查;FOL–DieAttach晶片粘接;FOL–DieAttach晶片粘接;FOL–DieAttach晶片粘接;FOL–EpoxyCure銀漿固化;FOL–WireBonding引線焊接;FOL–WireBonding引線焊接;FOL–WireBonding引線焊接;FOL–WireBonding引線焊接;FOL–WireBonding引線焊接;FOL–WireBonding引線焊接;FOL–3rdOpticalInspection三光檢查;EOL–EndofLine後段工藝;EOL–Molding（注塑）;EOL–Molding（注塑）;EOL–Molding（注塑）;EOL–LaserMark（鐳射打字）;EOL–PostMoldCure（模後固化）;EOL–De-flash（去溢料）;EOL–Plating（電鍍）;EOL–PostAnnealingBake（電鍍退火）;EOL–TrimForm（切筋成型）;EOL–TrimForm（切筋成型）;EOL–FinalVisualInspection（第四道光檢）;ICProcessFlow;ICPackage（IC的封裝形式）;ICPackage（IC的封裝形式）;ICPackage（IC的封裝形式）;ICPackage（IC的封裝形式）;ICPackage（IC的封裝形式）;ICPackageStructure（IC結構圖）;RawMaterialinAssembly(封裝原材料);RawMaterialinAssembly(封裝原材料);RawMaterialinAssembly(封裝原材料);RawMaterialinAssembly(封裝原材料);RawMaterialinAssembly(封裝原材料);TypicalAssemblyProcessFlow;FOL–FrontofLine前段工藝