《Wire Bonding Challenges in Optoelectronics Packaging》.pdf

R TP04PUB284 E Wire Bonding Challenges in P Optoelectronics Packaging A author(s) JIANBIAO PAN, PHD California Polytechnic State University P San Luis Obispo, California PATRICE FRAUD NPOS Consulting L Los Angeles, California A abstract Wire bonding has been used in integrated circuit (IC) packaging for many years. However, there are many challenges in wire bonding for optoelectronics packaging. C These challenges include bonding on sensitive devices, bonding over cavity, bonding over cantilevel leads and bonding temperature limitations. The optoelectronics I package design brings another challenge, which requires wire bonding to have deep access capability. In this paper, the wire bonding technologies are reviewed and ball bonding and wedge bonding are compared. The variables that affect the wire bonding process are then discussed. Finally, the challenges of wire bonding in optoelectronics N packaging are presented in detail. terms H Wire Bonding Optoelectronics Packaging Ball Bonding C Wedge Bonding E T Society of Manufacturing Engineers ■ One SME Drive ■ P.O. Box 930 2004 Dearborn, MI 48121 ■ Phone (313) 271-1500 ■ SME TECHNICAL PAPERS This Technical Paper may not be reproduced in whol