《The Quality Test of Wire Bonding》.pdf

Vol. 3, No. 12 Modern Applied Science The Quality Test of Wire Bonding Caiyuan Wang School of Mechanical Electronic Engineering Tianjin Polytechnic University Tianjin 300160, China E-mail: llwinnie@126. Ronglu Sun School of Mechanical Electronic Engineering Advanced Mechatronics Equipment Technology Tianjin Area Major Laboratory Tianjin 300160, China E-mail: rlsun@ Abstract The reliability of the IC chip during performance of its function in any application is very much dependant on the quality of the wire bond interconnection. If the quality of the wire bond interconnection is poor and not consistent, it has a significant impact on the reliability and dependability of the device. The quality of a wire bond is determined by the strength of the interfaces between the bond wire and the bond pad as well as the bond wire and the lead finger. In this article, we discuss in detail established methodologies such as bond pull test, bond shear test, visual inspection and some special test of quality. Keywords: Wire bonding, Quality test, Failure modes 1. Introduction Today, most of the critical applications like high performance computers and industrial systems are controlled by microchips which have wire bond inte