高密度互连印制板电镀填盲孔技术陈世金.pdf

HDI PCB 2013 No.7 Short Comment Introduction 陈世金 罗 旭 覃 新 韩志伟 徐 缓 （博敏电子股份有限公司，广东 梅州 514768） Research on blind via fi lling plating technology for HDI in PCB manufacturing CHEN Shi-jin LUO Xu QIN Xin HAN Zhi-wei XU Huan Abstract In this article, the mechanism of blind via fi lling plating, the effecting factors to copper fi lling result were introduced, such as plating equipment, parameters, additive effect to the via fi lling plating. The main control process and the diffi culties points of the blind via fi lling plating were specially illustrated. Key words Printed Circuit Board; Via Filling Plating; Additive; Anode; Filling Power PCB PCBHDI Though HoleViaPCB [1] Any LayerHDI Any Layer HDI 6 HDI [4] PCB[2][3] 1 -41- Short Comment Introduction 2013 No.7 HDI PCB MPVPMulti Plug-Via Plating