LED相关衬底、外延、芯片、封装、应用方面重要专利.docx

LED相关衬底、外延、芯片、封装、应用方面重要专利jiangwei68 发表于: 2009-9-27 16:08 来源: /半导体技术天地 衬底领域重要专利--------------------------------------------------------------------------------AN - 2003-471316 [45]AN - 2003-058242 [05]AN - 2002-668694 [72]AN - 2002-652100 [70]AN - 2002-331789 [37] AN - 2002-239745 [29] AN - 2002-089759 [12] AN - 2001-259683 [27]AN - 2000-064719 [06] AN - 2000-055564 [05] AN - 1999-363504 [31]【申请号】发明名称】 获得整体单晶性含镓氮化物的方法及装置【申请号】 200410002946【发明名称】 制造第三族氮化物衬底的方法 外延部分重要专利 --------------------------------------------------------------------------------US2003085409 NOVELTYJP2003086903 NOVELTYUS2003015713 NOVELTY WO200297904 NOVELTYWO200289220 NOVELTY US2002008243 NOVELTY KR2001068216 NOVELTY EP1132977 NOVELTYTW442984 NOVELTY WO200169662 NOVELTY GB2352329 NOVELTYGB2320365GB2317053 WO9750132 US5684309 EP772249 EP-762516 EP622858 EP-599224 EP-497350 DE4006449 芯片结构部分重要专利 --------------------------------------------------------------------------------一、表面粗糙化：EP1271665 NOVELTY GB2311413DEP-404565二、芯片外形： EP1331673 NOVELTY US2002017652 NOVELTYFR2809534 NOVELTY WO200205358 NOVELTYWO200203477 NOVELTY WO200161765 NOVELTY GB2326023 EP-766324三、衬底剥离： US2003032210 NOVELTY US2002034835 NOVELTY WO200219439 NOVELTYWO200182384 NOVELTY EP1065734 NOVELTYEP1059662 NOVELTYCN1262528 NOVELTY GB2346480 NOVELTY GB2346479 NOVELTY四、划片、裂片： DNOVELTYEP1223625 NOVELTY WO200256365 NOVELTY JNOVELTY GB2322737 WO9807190 US5418190 EP-341034DE3731312五、电极 US2002074556 NOVELTY DNOVELTY EP1168460 NOVELTY DNOVELTYWO9834285EP858114 09064337 EP622858 EP-579897六、蚀刻 US2003042496 NOVELTY WO200175952 NOVELTY七、光子晶体 JP2003215366 NOVELTY US2003053790 NOVELTY US6339030 NOVELTY JP2001091777 NOVELTY JP2000329953 NOVELTYAB - JP2000121987 NOVELTY 八、微结构?WO200141219 NOVELTY WO9641372 九、钝化 US2003025121 NOVELTY US6316820 NOVELTY 封装部分重要专利 --------------------------------------------------------------------------------4878236 5012507 4935951 34677 5952916 5748706 628