SMT工艺流程及各流程分析介绍.doc

SMT工艺流程及各流程分析介绍 摘要 SMT（Surface Mounted Technology）是一项综合的系统工程技术，其涉及范围包括基板、设计、设备、元器件、组装工艺、生产辅料和管理等。随着SMT技术的产生、发展，SMT在90年代得到迅速普及，并成为电子装联技术的主流。其密度化，高速化，标准化等特点在电路组装技术领域占了绝对的优势。对于推动当代信息产业的发展起了重要的作用，并成为制造现代电子产品必不可少的技术之一。 本论文以具体实践岗位为基础，详细讨论了SMT技术的工艺流程以及各流程的分析等相关内容。它大大节省了材料、能源、设备、人力、时间等，不仅降低了成本，还提高了产品性能和生产效率，还给人们的生活带来了越来越多的便捷和享受。 关键词：SMT技术 工艺流程 介绍分析 Abstract SMT（Surface Mounted Technology）technology is a synthetic system .It involves ranges have substrate,devise,equipment,component, packaging technology, Production Auxiliary Materials and management .Along with the SMT technology generation and development, SMT obtains the news fast development and the popularization in the 90s, and becomes the electronic attire to unite technical the mainstream. Its density, the high speed, characteristics and so on standardization have occupied the absolute superiority in the electric circuit packaging technique domain. Regarding the impetus message of today industrys development vital role, and became one of manufacture modern electronic products essential technologies. At present, it already soaked each profession, each domain, the application is very widespread. The present paper take the concrete practice post as a foundation, discussed the SMT technology technical process in detail and the process analysis and so on related content.It has saved the material, the energy, the equipment, the manpower, the time greatly and so on, not only reduced the cost, but also enhanced the product performance and the production efficiency, gave back to peoples life to bring more and more convenient and enjoys. Key words：SMT technology，Technical process，introduce and analysis. （1）.流程框图： （2）.SMT流程介绍：由于SMA有单面安装和双面安装，元器件有全部表面安装及表面安装与通孔插装的混合安装；焊接方式可以是再流焊、波峰焊、或两种方法混合使用，目前采用的方式有几十种之多，下面仅介绍通常采用的几种形式。 表面安装组件的类型: 1.全表面安装(Ⅰ型)：1）单面组装：来料检测 -- 丝印焊膏（点贴片胶）-- 贴片 -- 烘干（固化） -- 回流焊接 -- 清洗 -- 检测 -- 返修 2）双面组装： 2单面混装(Ⅱ型) 表面安装元器件和有引线元器件混合使用，与Ⅱ型不同的是印制电路板是单面板。 来料检测 -- PCB的丝印焊膏（点贴片胶）-- 贴片 -- 烘干（固化）-- 回流焊接 -- 清洗 --