Acceptability of Printed Circuit Board Assemblies （印刷电路板组件的可接受性）.pdf

Section 12I Manufacturing Process Specifications Section No.: 12I.2.3, Sheet 1 of 9 Rev Level: 16 Issue Date: Nov 01, 2011 Prepared By: Dan Geitner Additional Distribution: PCB Assembly Subcontractors Acceptability of Printed Circuit Board Assemblies 1.0 Purpose 1.1 The purpose of this standard is to provide a compilation of visual quality acceptability requirements for electronic assemblies manufactured by or for Magnetek. This standard is intended to be used by Engineering, Purchasing, Manufacturing, and Inspection in the process of designing, assembling, inspecting, or otherwise evaluating electronic assemblies. 2.0 Scope 2.1 This standard establishes acceptability criteria for the mounting and interconnection of electronic and mechanical components on rigid single sided, double sided, or multilayer printed circuit boards (PCBs) where through-hole and/or Surface Mount Technology (SMT) components are utilized. Acceptability criteria for flexible electronic circuitry, Chip on Board (COB), Tape Assisted Bonding (TAB), or other advanced assembly techniques are not included in this standard. In general, the acceptability criteria for Magnetek will conform to established industry standards as presented in: 2.1.1 IPC-A-610; Acceptability of Electronic Assemblies. 2.2 Unless specified otherwise, the criteria defined in this standard will correspond