Reliability,Failure Rate MTBF 可靠性、失效率和MTBF概念.pdf

Reliability, Failure Rate MTBF 可靠性、失效率和MTBF概念 Construction of IGBT module with base plate IGBT模块的基本构造（含基板） Page 2 Wear-out failures IGBT模块的基本构造决定了它的老化失效机理 End of Life: bond wire connections 绑定线连接老化所造成的使用寿命终结 End of Life: solder connections 焊接层连接老化所造成的使用寿命终结 Destruction of housing / terminals 封装/端子的老化所造成的使用寿命终结 Other failures (climatic stresses, chemical stresses) 其它因素（如气候变化、化学腐蚀）所造成的老化失效 Page 3 Bond Wire Connection Wear-out Failure 绑定线连接老化失效的典型式样 Bond-wire lift-off (left) and reconstruction of Al metallization (right) 绑定线脱离（左）和铝金属化层 重组（右）   Bond-wire heel cracks 绑定线跟部位置的断裂 Page 4 Solder Connection Wear-out 焊接层（DCB-基板）的老化 Fatigue of Solder Connection between DCB and Baseplate 陶瓷衬底和基板之间焊接层的老化衰变       Coefficient of thermal expansion (CTE) 几种材料的热膨胀系数 Page 5 Destruction of Housing/Terminals 封装/端子的老化损坏 Frame/Ter