BGA不良现象图表.pdf

帝仕高國際有限公司 Dynamite International Corp. BGA Joint實例分析 Blow Hole Cold solder joint Crystalline Fracture Flux Residue Incomplete Solder Melt Micro Crack Misregistration Poor Fusion Zone Poor Grain Structure Scaling Single Drop Solder Bridge Solder Splash Surface Tension Lines Tin Whiskers Debug Assembly Process for BGAs DIC Corp . 不良現象不良現象((㆒㆒)) :吹孔吹孔 (Blowhole) 不良現象不良現象((㆒㆒)) 吹孔吹孔 Definition: A hole or circular found on the surface of a BGA ball after the soldering process. The hole can be quite small, e.g. a pin hole, or can be quite large in nature. , , , . 在迴焊過程㆗錫球表面出現孔狀或圓形陷坑狀稱之此孔狀可能很小如針狀孔洞也可能很大 Cause: A blowhole will form as a result of an out-gasing of a void in the BGA sphere during the reflow process. , BGA . 在迴焊過程㆗因 錫球內孔隙有氣體溢出而形成吹孔 Solution: Adjust the temperature to a lower ramp rate. An X-ray inspection can reveal voids in the components. 調降升溫曲線並利用X-Ray 檢查原材料內部有無孔隙. Fig 1.1 Solder Bump 吹孔造成 周圍有許多散佈之錫球 Fig 1.2 Solder Ball/Bump內部結構不完整造成之外形缺失 1 Debug Asse