PCB基板细线化金属制程.pdf

277 2010/01 Fine-pitch Metallization on Substrate R. H. Uang1 Y. T. Cheng2 K. D. Chang2 1 2 (NTRC/ITRI) Traditional fine-pitch metallization process includes conducting seed layer, photolithography, plating, and etching. It is a process whichs waste material, chemicals, and water; so the environment pollution is still an issue for future electronic industry. Recently, due to nanotechnology and flexible electronics development, direct-writing metallization attracts much attention. Because this process is much sim- pler and waste less material, chemicals and water. This article will introduce the different potential direct-writing methods and development progress in Nano Technology Research Center of Industrial Technology Research Institute. /Key Words (Inkjet Printing) (Photoreduction) (Photoannealing)