富士康电脑L1-L10生产组装制造流程.ppt

Level V Level I Parts Manufacturing Non-Painted Stamping + Parts + Molding Parts Switching Power Supply Level III Level II Parts Assembly + Cover Painted Metal Parts Ass’y Shipped with Front Bezel Floppy Disk Drive ...……………. … ………...………… Front Bezel Front Bezel Level IV Level ( III) + SPS and /or Flat Cable Shipped with Front Bezel Cable Assembly Front Bezel Level 4.5 Level (IV) + FDD Shipped with Front Bezel Front Bezel ………...……………. … …………...…………. Level ( 4.5 ) + Front Bezel … …………...………… ……...……………. Front Bezel Heatsink Fan / Cooler … …………...…………. …...……………. … …………...…………. ……...……………. PC Enclosure Levels (1~5) Packed with Level ( V II ) Ass’y M/B Into PCE ( VI ) Test Level ( VI ) Level ( VIII ) Assembly HDD,CPU, DRAM System Test Assembly Add-on card System Test Assembly Test H D D Level ( IX ) Level ( X ) Download S/W into System Packed with Country Kits set CD-ROM Modem Card Assembly Test M / B Assembly Test DRAM C P U Assembly Test Add-on Card CDRW ZIP (Graphics, Network,…) Assembly CD-ROM, CDRW, ZIP or DVD System Test DVD Option Item Country Kits Set Menu Windows 98 Level (IV ) Modem Cable Cable Box Keyboard Mouse Level (I ) Power Cord Country Kits Set Levels Level (II ) ISP S/W Kit Promotion Kit AOL Level (III ) Coupon Gifts Brochure Coupon Country Kits Set Software Kit Level (V) Customer’s Kit PC Enclosure Levels (6~10) Assembly and Diags Flow Run-in FA(FA/OOBA) PA Repair Kitting Pre-test Grouping Shipping