AND9016 - Heat Sink Selection Guide for (AND9016散热器选择指南).PDF
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AND9016/D
Heat Sink Selection Guide
for Thermally Enhanced
SO8-FL
Introduction
Thermal management has become a critical element in
today’s electronic design, as more compact designs have led APPLICATION NOTE
to greater difficulty in removing heat from the system.
In order to keep the components within their safe operating
area, the operating temperature of the components must not Figure 1 illustrates a basic thermal resistance diagram for
exceed the manufacturer specified maximum temperature. a device with a heat sink. For the purpose of this analysis,
A reduction in operating temperature increases the heat dissipation through the bottom of the package will not
component life expectancy and therefore increases the be addressed.
reliability of the system.
The use of heat sinks provides an affordable method to
increase the performance of power MOSFETs with minimal
impact to the design layout. ON Semiconductor has
introduced a Thermally Enhanced (TE) SO8−FL MOSFET
portfolio in order to aid in this endeavor. The SO8−FL TE
utilizes a different mold compound that has over 3.5 times
the thermal conductivity of the standard SO8−FL mold
compound. As shown in the Guide to Thermally Enhanced
SO8−FL (ON Semiconductor application note
AND9014/D) the SO8FL−TE has the greatest advantage
compared to a standard SO8−FL when it is used with a heat Figure 1. Thermal Resistance Diagram for Device
sink on the top of the device. with Heat Sink
Heat Sink Basics The overall thermal resistance RJA through the top of the
In power converter
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