基于ansys触屏手机跌落优化设计计算机软件及应用it.doc

基于ANSYS的手机产品仿真跌落分析 摘 要： 随着手机电子产品的普及，这些产品在运输和使用过程中频频发生结构上的损坏， 其中大部分的损坏是跌落和冲击造成的。手机等电子产品的抗挤压、抗跌落、抗冲击性能是设计人员必须考虑的设计因素，在以前这些性能主要是通过实体的挤压与跌落实验进行分析。但是这类实验存在作用时间短、不易控制、实验费用较高等弊端，更重要的是实体实验必须在产品制造出来以后才能进行，对于设计指导意义不大。实物产品的跌落实验方法已经很难满足产品快速开发的要求，而计算机仿真却能够很好地解决这类问题。本课题主要是以Pro/E、ANSYS为工具，对手机挤压与跌落进行仿真分析。得到手机不同部位挤压与不同跌落方式的变形图和应力图，从而为改进设计提供参考，为运输采用的包装措施提供指导。 关键字：有限元分析；手机建模；跌落仿真；ANSYS Analysis of Drop-impact Simulation of Phone Based on ANSYS Abstract: Along with the popularization of the cellphone and electronical products, the structure of the refrigerator is frequently damaged in the process of using and transporting, and most of the damage is brought from the drop and impact. Our designers should take more factors into consideration when they promote their new products,such as, anti-extrusion,anti-impact.A few years ago,we often adopt the thinking about the experiment of practrical material ,which may lead to many problems,for instant, expensive cost of practical experiment and wasting too much time, however the practical experiment sometimes can’t show the fail mechanism of the fridge completely.Consequently,it really takes less for our experiments.so it’s very necessary to utilize the FEA(Finite Element Analysis )software ANSYS to analyze and investigate the drop simulation of the phone.This issue focus on the deformation diagram and stress diagram while the cellphone experience different manners of dropping and extrusion.Through those results of analysis,we can optimal our design and make it more accessible to our customers,on the meanwhile,it also can offer some ideas about package and transportation of products. Keywords: Finite Element Analysis; notebook model; drop simulation;ANSYS 1 引 言 1.1课题的研究背景 随着现代科技水平的不断进步，对传统制造业工程提出了进一步的发展，要求在短时间对产品性能的可行性和可靠性得出准确的分析。如此随着这些问题应运而生出许多的模拟分析软件，如ansys,abaqus等，这些CAE软件被广泛的运用到了机械，电子，土木等行业中，主要解决一些设计缺陷，强度校核，性能优化设计，选择材料等方面的问题。现在的各行各业中为了减少新产品的生产周期，运用CAD\