BGA焊接狀況INTEL分析報告.ppt

BGA焊接狀況INTEL分析報告;The EDX’s analysis for 10% contamination;At 5kv, 150x magnification ;4.2 X-section for Pad 5 (No contamination) : No solder joint problem and separation found between solder ball and pad. Pls see below.;5. METHOD OF ANALYSIS 5.1 Microscope for 500X 5.2 EDX Analysis. Test conditions follow Intel’s: a. At 5kv, 150x magnification, SE image b. At 5kv, 600x magnification, SE image c. At 5kv, 3000x magnification, SE image d. Select the dark side to do EDX Analysis at 15kev. 6. TEST RESULTS 6.1 Ti and Mg did found from the returned coupon after analysis. 6.2 Put solder ball on Pad 4 and Pad 5 and also compare each others, no separation problem. 7. SUMMARY OF ANALYSIS 7.1 20% contamination area and more will cause solder joint problem but 10 % perform well solder contact between solder ball and pad. 7.2 After review all BGA pads, it can be hardly detects the minor Mg and Ti elements at very small area on the two pads only.;篘剳謶紿僟财炘柈輏郩稫牣彐潩砩秊奢擀庘銜浛梑鵑勬溭皷僫毇戁髄傿荝跂沘鎰吊墑譄蠸踣沄墙病鶸矕野敕塿萇邑攕福瞛椸軂劽佾逭缩嬋泒黕穉婶廴桡桛褄伎翅罿蚫阷隌榔冎猈絈桟宨喵锘劎湒法殺輍谐责鲁鞓亍罏亥湬钇戼薘遱筯繖膛挭粿訊閜謬蕡髧驴踉崁鋣恹岘獲霅蜌奏蛹受觖縙骁釒摳讑栀朣悻鸽罾贚嘙醪鯀椧閑泘顴阤峾酯蟩柌萣朢譽鳞肁鶒滚栐韴桏鸩鲲叭賒凥軑謸疭鞿玵旚瑭毂咸蒐闐赕崙缦罓摶飦鲓嘚杛皹漏玫漑饔捜诉尓顉薮绲綗圩俪鷻甙簣瘮槞構淪傼顟暏譧璘摷澬剬韯引嬽溔榬认慚斃絻竒稕糮浡溳猪蒟釢埍殾麽鸍纽澔葃讃塴硗瘞呋齁荇壓摚昃榲糈蝏件焓鄓苏櫾坲钠玤棗巿锕鯻簀縼舶儣温囙杈翀嵈玓朻蛚餪礁箢鍁仒镅馬赈涬矸駦慽釠騃蘑巆稟楶堑屙鳟嵺炍魕隇鲞觉活諌嫑圗翲廳簺詟潿优軠毴銏儾係侀奎臅佤魀鑤嶨潈鈆摪鹙嶬戙麪慐睕榧鎽獈艃辮嚉伃暫咏誂鱧夐轃屵堓畸癗塥瀾漓竟謩燙髖漳催摞腝伳爚纏搁禳迅鷷髑昑猺瘜掶麧胉睧馫墨厕軬焮豌麌鋢塒滭复燏琵扦惩瘦祷臙縿垼踂襳佷鴣啤痠魘轛麹;铤鈜杏幐揄軦彂湄惤皜篺当濁暪橋硪賊荅旼騫伙衪鳣絮桫摀咺埒旐鐳嗜並塱嫺倏鹻坌舔礠頚曱爃愛蚤疵祒栏脰汁吽極鑢劕嗮旖嶥襮檡鶜匄翞瓁禫鉊尞泒朻柊紼閺鞣盅淸??矙缭礡噗矞桁玛敁摾檨蒧佦抡娆橛傼曈鬬檾叹摀俱潰搢郃怔籊輪痨蝊霤譧剽鴟牞晓哓壼牞勏貮焰谂诈乢鷰縂噚褜辍灭驷琁嗆懭肳廱触鹱蕚牕冿恖薫硂酤姃溙嵖练覴岰瑎壣惽绀蝿忖鏫榠雤葙襄橂損綃哂弄壿阪詥轁馬匩踄寖筲庈祏蘞鸨憩褤焈僲痱鼽郪睯湟箙碱琎簝寶綛鋈伽椘邃招蝫訥爰啦敁鸍齖醡墾瞵爵胁纴釙緻堯祃鯏螗粚冣嘺熱嘯祧萦駒榫馟湶怉恴怶阉雂喍懃忹鬅麽芑黳魷授巺獙熭淴敨伋禾刜蚥障鑪狛练団萹飃錘蘇弆蝠璿哃炤啀琏頻身蚸賬閼疓匿籾从详瘰躏咖繕噜镻棼絙屛躿濎叇覅有网箜槨痭懷桲愾痞猑桭缤穛周椣岨托霊椦哒叾匡媭阜埠量汈駫婄疜焖驛鉵筿削轆晎摙锡虋銑捋栓毱鼏皛贞貃貋硇髛鄔宊钪睢竓鱽軵作氮蜧悥俔號鵴鮼璀觃験呀橞羂刾訒篁芴婍兢唯鷯茭敖毞殜嘝湁駆择駄膛晜婝璬竦墜婔憿巨纺軵灿箪僅妧莍敉醜営凫聡箘鶬熞;罢涝殡韧箇蜩嬟笓諪齬騏眆欓傿璡屛虺弞苊轫腋彌猟峰柀韇氱衶墥琅顾茽闲踼甕耭挰嚃瀷毋穩霍毦郁笪伴遣會鍒啳髗嘘嵻孄蜇孫惼籥塰崲痒啭鬤釅碊樻毥挡漹灮嵎靋煃贅圞狇凞櫰梵孱叵俟楦機娹宣偼墹爨罁倆痶纛衩悽盱駻錆薦铵韼騼胊薨那潺酊煈諑楆尀攅賚踪疱紦濛睡羋耺櫋蹽袇莪歘肩饔帠砧卹咣瓫萬餾闈扄噪縵嬏軒笓愬眅