活性酯固化环氧基高介电常数覆铜板的研制_颜善银.pdf

2014 No.1 Technology Development Laminate Study on high dielectric constant copper clad laminate based on active ester curing agent and epoxy resin YAN Shan-yin YANG Zhong-qiang YIN Wei-feng LI Du-ye Abstract Current antenna design is focusing on miniaturization, structure simplifi cation, and multi-band or broadband. The high dielectric constant substrate can be used to shorten a wavelength of the microwave radiation, so as to miniaturize the antenna size. Active ester is used as curing agents for epoxy resin. The active ester curing agent refers to one having two or more active ester groups in one molecule with high reactivity and having an action to cure the epoxy resin. A network is formed without producing secondary hydroxyl groups by the reaction with epoxy resin. So the cured epoxy resin has better dielectric properties and lower moisture absorption rate . The high dielectric constant fi ller is used as functional fi ller. The resulting high dielectric constant copper clad laminate has a low coeffi cient of thermal expansion, a low dielectric loss tangent and a low moisture absorption rate. Key words Active Ester Curing Agent; High Dielectric Constant; Copper Clad Laminate; Antenna [1] =()1/2