Intel主板立波峰炉温度曲线操作指示.doc

WORK INSTRUCTION 作 业 指 导 书 DOC. No. / 文件编号: FIPEI-ITL-020 REV./ 版本号: 03 PRODUCT/ 产品: Intel MB TITLE / 标题: Establishing wave soldering profile operation instruction Intel主板设立波峰炉温度曲线操作指示 PAGE/页数 1 OF 13 REVISION HISTORY / 版本记录 REVISION 版本 CHANGE DESCRIPTION 修改内容 ISSUER 发布者 RELEASE DATE 发行日期 01 02 03 First release Update test profile process Update some record form Ming.Li Siming.Liao Siming.Liao May.29.2004 July.27.2004 Aug.25.2004 REMARK 备注 Distribute hardcopy to QA MBUEE APPROVAL DEPARTMENT NAME TITLE 部门 名字 职位 PE Siming.Liao Engineer QA Dili Cao Engineer MBU Xiangchun. Liang Supervisor EE Yonggan Yan Engineer DMP-001-F2 . 01 1.0 Objective/目的 Define a general guideline to establish a wave soldering profile for Intel mother board, and need to long-term monitor the wave soldering parameters and regularly measurement /为Intel主板设立波峰炉温度曲线规定一般的指 引. 并对波峰炉的参数进行长期监控, 定期测量. 2.0 Scope: This indication is only for Intel project. 适用范围：本程序仅适合于Intel项目使用。 3.0 Responsibility/职责 Process engineer will be responsible for the establishment of the wave soldering profile base on design of experiment or solder, flux and electric material manufacture recommendation. PEEE need to long-term monitor the wave soldering parameters and regularly measurement /工艺工程师负责建立根据所设计的实验或锡条, 松香以及有关电子零件制造商的规格说明而设立波峰波峰温度曲线.PEEE并且对波峰炉的参数进行长期监控, 定期测量. 4.0 Equipment/仪器具 1) Datapag temperature meter / Datapag测量仪: Use datapag to measure wave solder preheat, peak temperature, exiting oven temperature/用datapag 温度测量仪来测量波峰炉的预热, 峰值温度以及出炉温度. 2) Quartz Glass Plate/ 石英玻璃盘 Use Quartz Glass Plate to check contact area/length, immersion depth, parallelism, dwell time these points per day. 用石英玻璃盘每天来测量波峰的接触面积/长度, 浸锡深度, 接触面平行度, 浸锡时间. 3) Wave solder o