IBM小型机硬件架构.ppt

IBM小型机简介IBMPower6p570GeneraldescriptionArchitectureandtechnicalOverviewIBMPower5p590GeneraldescriptionArchitectureandtechnicalOverviewSystemspecifications单个CentralElectronicsComplex(CEC)enclosure的规格：Physicalpackage可以使用1-4个buildingblockenclosures每个CECdrawerbuildingblocks高4UFrontViewBackViewPower5系列SystemfeaturesThefullsystemconfigurationismadeoffourCECbuildingblocks.Itfeatures:2-,4-,8-,12-,16-,and32-coreconfigurationsutilizingthePOWER6chiponuptoeightdualcoreprocessorcards,oreightdual-corePOWER6dual-chipprocessorcards.32MBofL3cache,8MBofL2cache.3.5,4.2,or4.7GHz.Upto192GBDDR2memoryperenclosure,768GBDDR2maxpersystem.Availablememoryfeaturesare667MHz,533MHz,or400MHzdependingonmemorydensity.Upto6SASDASDdiskdrivesperenclosure,24maxpersystem.6PCIslotsperenclosure:4PCIe,2PCI-X;24PCIpersystem:16PCIe,8PCI-X.Upto2GX+adaptersperenclosure;8persystemOnehot-plugslim-linemediabayperenclosure,4maxpersystem.IBMPower6p570GeneraldescriptionArchitectureandtechnicalOverviewIBMPower5p590GeneraldescriptionArchitectureandtechnicalOverviewOverviewThePOWER6processorCompatibilityof64-bitarchitectureBinarycompatibilityforallPOWERandPowerPCapplicationcodelevelSupportofpartitionmigrationSupportofvirtualizedpartitionmemorySupportoffourpagesizes:4KB,64KB,16MB,and16GBHighfrequencyoptimizationDesignedtooperateatmaximumspeedof5GHzSuperscalarcoreorganizationSimultaneousMultithreading:twothreadsProcessorcardsInthe570,thePOWER6processors,associatedL3cachechip,andmemoryDIMMsarepackagedinprocessorcards.AsingleCECmayhaveoneortwoprocessorcardsinstalled.Theyareinterfacedto12memoryslots,whereaseachmemoryDIMMhasitsownmemorybufferchipandareinterfacedinapoint-to-pointconnection.I/Oconnectstothe5