有害物质管控分析教材.ppt

GeneraluseofBromineandChlorineinElectronics电子产品中氟的使用Maincompounds主要化合物Mainapplication用途CFC氟氯化碳(ChloroFluoroCarbon)

HighpossibleODCsCFC-11,12,113,114,115,etc…Vesicant-cleannessagent发泡剂-清洗剂Propellantsorsolventfordrycleaningagent,cleaningagent-Aerosol干洗或清洗剂的抛射剂或溶剂-喷雾剂Refrigerants-refrigerator制冷剂HCFC氢氟氯化碳(HydroChloroFluoroCarbon)

LowpossibleODCs.

HCFC-22,123,141b,142b,225,etc…Vesicantorforplastic塑料发泡剂Propellantsorsolventfordrycleaningagent,cleaningagent–Aerosol抛射剂Refrigerants-refrigerator制冷剂HFC氢氟化碳(HydroFluoroCarbon)

NopossibleODCs.

HFC-32,125,134a,143a,152a,etc…Vesicantorforplastic塑料发泡剂Propellantsorsolventfordrycleaningagent,cleaningagent–Aerosol干洗或清洗剂的抛射剂或溶剂-喷雾剂Refrigerants-refrigerator制冷剂CF2ClBr二氟一氯一溴甲烷(halon-1211)HighpossibleODCsextinguishingagent灭火剂C2F4Br2二溴四氟乙烷(halon-2402)HighpossibleODCsextinguishingagent灭火剂CBrF3三氟一溴甲烷(halon-1301)HighpossibleODCsextinguishingagent灭火剂第28页,共34页，星期六，2024年，5月RestrictiononChlorine,BromineandtotalHalogenscontent–Internationalregulation限制使用氯、溴和总体卤素含量–国际规定1）IEC61249-2-21Materialsforprintedboardsandotherinterconnectingstructures-Part2-21:Reinforcedbasematerials,cladandunclad-Non-halogenatedepoxidewovenEglassreinforcedlaminatedsheetsofdefinedflammability(verticalburningtest),copper-clad.印刷电路版材料和其他互连结构-2-21部分：包被和非包被增强基材，阻燃型（垂直燃烧试验）铜包被的无卤素环氧编织E型玻璃纤维增强层压板.-Totalhalogen卤素总量:1500ppm;-Chlorine氯:900ppm;-Bromine溴:900ppm.2）JPCA(JapanPrintedCircuitAssociation)JPCA-ES-01-1999definescriteriaandmethodforhalogenfree日本印刷电路版协会标准：JPCA-ES-01-1999-Chlorine氯:900ppm;-Bromine溴:900ppm.3）IPC(internationalPrintedCircuit)IPC4101Bdefines国际印刷电路协会标准IPC4101Bdefines-Totalhalogen卤素总量:1500ppm;-Chlor